Picture of SPTS APS - SiO2 Etcher
Current status:
WARNING
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1st Responsible:
2nd Responsible:
Group:
29_Microfabrication and Exploratory Nanotechnology
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SPTS APS - A system for Reactive Ion Etching consisting of a load lock for 200mm diameter wafers and a process chamber for anisotropic etching of silicon oxide, silicon nitride, polysilicon, and other materials such as amorphous Si, using a plasma source and fluorine chemistry. The process chamber is of metallic construction and is heated to reduce the level of deposition on it. The system has an optimised geometry to improve plasma confinement, which further increases the plasma density above the wafer and also hinders undesirable deposition inside the chamber.

Tool name:
SPTS APS - SiO2 Etcher
Area/room:
01.01. Cleanroom
Manufacturer:
SPTS
Model:
APS LPX
Booking type:
Optional

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Licensed Users

Micro and Nanofabrication
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