Picture of Chemical Mechanical Planarization
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AVAILABLE
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1st Responsible:
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Group:
29_Microfabrication and Exploratory Nanotechnology
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Chemical mechanical planarization is a process that can smoothen topography or various materials It is used to planarize oxide, poly silicon or metal layers in order to prepare them for post-lithographic steps, avoiding depth focus problems during illumination of photosensitive layers. The tool includes a two-carrier system for polishing and planarizing single wafers with diameters up to 200mm as well as for coupons and part wafers (irregular-shaped samples).

Tool name:
Chemical Mechanical Planarization
Area/room:
01.01. Cleanroom
Manufacturer:
Logitech
Model:
ORBIS
Booking type:
Optional

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Licensed Users

Micro and Nanofabrication
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