Picture of AMMT Cu Electroplating
Current status:
AVAILABLE
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1st Responsible:
2nd Responsible:
Group:
29_Microfabrication and Exploratory Nanotechnology
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µGalv is a process tool allowing Cu electrodeposition on wafer up to 200mm. The media flow system guarantees excellent homogeneity all across the even large wafers.Rotating wafer holders ensure optimal uniformity in both every plating cell design.

Tool name:
AMMT Cu Electroplating
Area/room:
01.01. Cleanroom
Manufacturer:
AMMT GmbH
Model:
AMMT
Booking type:
Compulsory

Instructors

Licensed Users

Micro and Nanofabrication
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