The SPTS Pegasus is a system dedicated for deep reactive ion etching of silicon using the Bosch Process. It is able to perform anisotropic etching of Si trenches with high aspect ratios and through wafer vias. For that, it uses a switched process by alternated cycles of SF6 plasma etching and C4F8 plasma for polymeric deposition.
Helium gas is used for aiding backside cooling of the substrate.
This system consists of the following:
Single wafer loadlock (LPX);
One process chamber;
Mechanical and Turbo Pumps
Distribution E-Rack with:
6.5KW 13.56MHz RF Power Supply on source generator;
300W 13.56 MHz RF Power Supply on lower electrode generator;
500W 380 KHz RF Power Supply on lower electrode generator;
De-ionized and low temperature coolant (galden) chillers;
Gas cabinet with: C4F8; O2; SF6;
Fast response MFC on top coil assembly;
Electrostatic clamping system (TD-ESC) and wafer Helium substrate backside cooling.