Picture of Wire Bonder / Gold ball bond
Current status:
AVAILABLE
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1st Responsible:
2nd Responsible:
Group:
29_Microfabrication and Exploratory Nanotechnology
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This HB16 tool is prepared for ball bond with gold wire 25 µm. It accepts flat samples (single-side PCB) up to 50 mm, standard DIL chip carriers and other standard packages. It is equipped with a heating stage to faclitate the gold bonding.

Tool name:
Wire Bonder / Gold ball bond
Area/room:
01.01. Cleanroom
Manufacturer:
TPT HB
Model:
HB16
Booking type:
Optional

Instructors

Licensed Users

Micro and Nanofabrication
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