Picture of MNF_SPTS APS - SiO2 Etcher
Current status:
AVAILABLE
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1st Responsible:
2nd Responsible:
Group:
09_Micro and Nanofabrication Facility
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SPTS APS - A module for Reactive Ion Etching consisting of a process chamber for anisotropic etching of silicon oxide, silicon nitride, polysilicon, and other materials such as amorphous Si, using a plasma source and fluorine chemistry. The process chamber is of metallic construction and is heated to reduce the level of deposition on it. The system has an optimised geometry to improve plasma confinement, which further increases the plasma density above the wafer and also hinders undesirable deposition inside the chamber.

Tool name:
MNF_SPTS APS - SiO2 Etcher
Area/room:
01.01. Cleanroom
Manufacturer:
SPTS
Model:
APS
Booking type:
Compulsory

Instructors

Licensed Users

Micro and Nanofabrication Facility
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