Picture of MNF_Timaris FTM - TiW, AlSiCu and Al2O3 sputtering
Current status:
Book | Log
Show/Collapse all

1st Responsible:
2nd Responsible:
09_Micro and Nanofabrication Facility
You must be logged in to view files.

The Four-Target-Module (FTM) physical vapor deposition cluster tool is especially designed for deposition of high–quality metallic, conductive and insulating films. The system is a UHV single wafer cluster tool and consists of one transport module, one multi-target PVD module with up to four DC/RF cathodes (three targets are install in this machine AlSiCu, TiW and Al2O3) and one soft etch/oxidation module. It is capable of depositing different magnetic and non–magnetic layers on wafers with diameters up to 200mm by DC/RF Magnetron Sputtering, with good uniformity for the deposited films.

The FTM incorporates Linear Dynamic Deposition (LDD) technology in combination with up to four sputter targets in one vacuum chamber. The LDD technology enables the capability to deposit wedge films with a different film thickness across the wafer and to deposit alloy films with adjustable concentration gradients across one wafer.

Tool name:
MNF_Timaris FTM - TiW, AlSiCu and Al2O3 sputtering
01.01. Cleanroom
Timaris FTM
Booking type:


Licensed Users

Micro and Nanofabrication Facility
You must be logged in to view tool modes.